Fraisse, G.; Viardot, C.; Lafabrie, O.; Achard, G.
November 2002
Energy and Buildings, vol 34-10, p. 1017-1031
The modeling of the thermal behavior of buildings requires using relatively heavy data processing when it comes to reproducing reality accurately. Electrical analogy makes it possible to develop directly accurate and simplified models insofar as the temperatures within the walls are not required.
We present the various stages, which led us to propose the global analogical model of the building. Initially, we have studied how to transform a multi-layer wall into a three resistances and four capacities model (3R4C). We will compare this model with other electrical models thanks to a time and frequency analysis. Then, we will deal with the principle of aggregation of several walls. In order to facilitate the iterative resolutions related to numerical simulations, the lumped model integrates a heating floor.
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